What is Rogers RO4350B?
RO4350B is a glass-reinforced hydrocarbon/ceramic thermoset laminate used in RF and microwave printed circuit boards
MATERIALS
Material reference
RO4350B properties, test conditions, thicknesses and procurement details.
| Property | Value | Measurement basis |
|---|---|---|
| Process dielectric constant | 3.48 ± 0.05 | 10 GHz, 23°C; clamped stripline |
| Design dielectric constant | 3.66 | 8–40 GHz; differential phase length |
| Dissipation factor | 0.0037 | 10 GHz, 23°C; typical |
| Dissipation factor | 0.0031 | 2.5 GHz, 23°C; typical |
| Glass transition temperature | >280°C | TMA; not a continuous-use rating |
| Decomposition temperature | 390°C | TGA; not a reflow setting |
| Thermal conductivity | 0.69 W/(m·K) | 80°C; typical |
| CTE, X / Y / Z | 10 / 12 / 32 ppm/°C | −55 to 288°C |
| Moisture absorption | 0.06% | 48 h, 50°C immersion; 0.060-inch sample |
| Density | 1.86 g/cm³ | 23°C |
| Copper peel strength | 0.88 N/mm | 1 oz ED foil; after solder float |
| Flammability | UL 94 V-0 | Standard laminate; verify exact construction |
The 4 mil core has a separate process-Dk value of 3.33 ±0.05. Typical values are not procurement limits. Read conditions and exceptions.
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16 topics
RO4350B datasheet: how to read the specifications
The RO4000 data sheet separates typical properties from specification limits
RO4350B dielectric constant: 3.48 versus 3.66
The standard published process Dk is 3.48 ±0.05 at 10 GHz and 23°C
Choosing design Dk for a RO4350B simulation
A design Dk of 3.66 is a useful published starting point for standard RO4350B
RO4350B dissipation factor and dielectric loss
The cited RO4000 data sheet lists typical RO4350B dissipation factor of 0.0037 at 10 GHz and 0.0031 at 2.5 GHz
RO4350B laminate thicknesses and tolerances
Standard thicknesses in the cited sheet include 4, 6.6, 10, 20, 30 and 60 mil
Copper weight and foil choice for RO4350B
Copper thickness and copper surface profile are separate design choices
RO4350B Tg versus Td: different thermal limits
RO4350B has a published Tg above 280°C and a typical decomposition temperature of 390°C in the cited data sheet
RO4350B thermal expansion and plated-hole reliability
The cited typical X, Y and Z coefficients of thermal expansion are 10, 12 and 32 ppm/°C
Thermal design with RO4350B
A typical thermal conductivity of 0.69 W/(m·K) at 80°C is reported for RO4350B
RO4350B moisture data and handling
The dated data sheet used here reports typical moisture absorption of 0.06% after its stated immersion test on a 0.060-inch sample
RO4350B LoPro: foil and construction considerations
RO4350B LoPro uses a modified bonding construction with reverse-treated foil to reduce conductor-related loss
The 4 mil RO4350B process-Dk exception
The cited Rogers data sheet gives 4 mil RO4350B a process Dk of 3.33 ±0.05
Glass reinforcement and local RF variation
RO4350B is reinforced, so a bulk material description does not fully describe every local field path
Storing RO4350B cores and finished boards
Storage controls should preserve surface condition, traceability and the handling requirements of the complete board
How to verify RO4350B material traceability
Board color, surface finish and a silkscreen label cannot prove that a board uses RO4350B
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