Rogers RO4350B Material Properties
Complete datasheet reference for Rogers 4350B PCB — electrical, thermal, mechanical, and available thickness specifications.
| Dielectric Constant (Dk) | 3.48 ±0.05 |
| Loss Tangent (Df) @10GHz | 0.0037 |
| Volume Resistivity | 1.2×10¹⁰ MΩ·cm |
| Surface Resistivity | 4.2×10⁹ MΩ |
| Dielectric Breakdown | 500 V/mil |
| Arc Resistance | 125 sec |
| Glass Transition Temp (Tg) | >280°C |
| Decomposition Temp (Td) | 390°C |
| Thermal Conductivity | 0.69 W/m·K |
| CTE X-axis | 10 ppm/°C |
| CTE Y-axis | 12 ppm/°C |
| CTE Z-axis | 32 ppm/°C |
| Tensile Modulus | 12,066 MPa |
| Tensile Strength | 186 MPa |
| Flexural Strength | 241 MPa |
| Peel Strength (1oz Cu) | 1.05 N/mm |
| Density | 1.86 g/cm³ |
| 4 mil (very thin) | 0.102 mm |
| 6.6 mil | 0.168 mm |
| 10 mil | 0.254 mm |
| 20 mil (popular) | 0.508 mm |
| 30 mil | 0.762 mm |
| 60 mil (thick) | 1.524 mm |
Frequently Asked Questions — Rogers RO4350B PCB
Microstrip Impedance Calculator
Calculate characteristic impedance Z₀ for Rogers 4350B PCB using Wheeler's approximation.
| 10mil sub (0.254mm) | W = 0.55mm |
| 20mil sub (0.508mm) | W = 1.12mm |
| 30mil sub (0.762mm) | W = 1.68mm |
| 75Ω on 10mil sub | W = 0.25mm |
| 100Ω on 10mil sub | W = 0.10mm |
Layer Stack-up Designer
Visualize and configure Rogers 4350B PCB layer stack-ups for 2-layer and 4-layer hybrid designs.
| RO4450F | Dk 3.52 — best for Rogers-to-Rogers bonding |
| RO4450B | Dk 3.54 — halogen-free variant |
| Thickness | 3–4 mil (0.076–0.102mm) |
| FR-4 hybrid bonding | Supported with proper CTE matching |
| Max layer count | 20+ layers achievable |
Rogers 4350B PCB Design for Manufacturing Tips
Key PCB design and fabrication rules for Rogers RO4350B, verified by PCBSync RF engineers.
Drilling Considerations
Rogers 4350B requires carbide drills with high helix angles. Minimum via: 8mil (0.2mm). Use pecking cycles for aspect ratios >6:1. Reduce drill speed 20% vs. FR-4 to prevent delamination and fiber pull-out.
Copper Adhesion
Use micro-etching surface prep before copper plating. Ensure peel strength >1.0 N/mm for 1oz copper. Avoid aggressive alkaline cleaners — they degrade RO4350B surface chemistry and reduce adhesion.
Impedance Control
Account for ±0.05 Dk variation in impedance budgets. Always include test coupons in the panel for impedance verification. Use ground pour stitching every λ/20 and maintain the 3H trace-to-edge clearance rule.
Via Design for RF
Add via fencing around all RF traces at λ/10 spacing. Back-drill stubs for frequencies >5GHz to eliminate resonance. Use filled-and-capped via-in-pad for fine-pitch components. Add ground via arrays at connector transitions.
Thermal Management
Apply thermal relief on high-power component pads. Add thermal vias under QFN/BGA packages. Copper coin insertion helps with heat spreading in PA designs. Operating range: −55°C to +125°C.
Hybrid Stackup Design
Rogers 4350B supports hybrid stackups with FR-4 using RO4450F prepreg — use Rogers for RF signal layers and FR-4 for digital/power to reduce cost. Carefully match CTE at material transitions to prevent thermal cycling delamination.
Surface Finish Selection
ENIG is preferred for Rogers 4350B RF PCBs — flat, consistent, excellent solderability. Immersion silver offers outstanding HF performance. OSP acceptable below 3GHz. Avoid HASL for fine-pitch components or designs above 6GHz.
Panel Utilization
Standard Rogers panel: 18"×24" or 18"×12". Optimize PCB placement for maximum material yield. Include tooling holes (Ø3.2mm), fiducials, and coupon rows. Min board-to-edge clearance: 5mm. Use 3mm breakaway tabs with V-score or mouse bites.
Rogers 4350B PCB Cost Estimator
Estimate fabrication cost for your RO4350B PCB project. Contact PCBSync for a precise quote.
Rogers 4350B vs Other RF PCB Materials
How does Rogers RO4350B stack up against competing high-frequency laminates?
| Material | Dk @10GHz | Loss Tangent | Tg (°C) | Cost | FR-4 Process | Best For |
|---|---|---|---|---|---|---|
| Rogers RO4350B ★ | 3.48 ±0.05 | 0.0037 | >280 | Med–High | Compatible | 5G, Radar, SATCOM |
| Rogers RO4003C | 3.55 ±0.05 | 0.0027 | >280 | Med–High | Compatible | Lower-loss broadband |
| Taconic TLY-5 | 2.17 ±0.02 | 0.0009 | N/A (PTFE) | High | Special | Ultra-low loss mmWave |
| Isola I-Tera MT40 | 3.45 ±0.05 | 0.0031 | 200 | Medium | Compatible | Digital + RF hybrid |
| Ventec VT-901 | 3.80 ±0.05 | 0.0040 | 250 | Medium | Compatible | Cost-sensitive RF |
| Standard FR-4 | 4.2–4.8 | 0.018–0.022 | 130–180 | Low | Standard | Low-freq / digital |
Wavelength & RF Design Calculator
Compute free-space wavelength, guided wavelength, and key RF trace reference lengths for Rogers 4350B PCB at any frequency.
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