RF wavelength & phase calculator
Calculate free-space and guided wavelength, reference lengths and propagation delay.
Calculate a line. Plan a stackup. Understand the material.
A practical RO4350B PCB workbench, from first estimate to fabrication brief.
Uncovered surface trace · quasi-static estimate
Results will appear here.
Model limits. Zero-thickness copper model. No mask, roughness, dispersion or connector effects. Frequency sets wavelength only; impedance is quasi-static. Final geometry needs field-solver and fabricator verification. Read the methodology.
Calculate free-space and guided wavelength, reference lengths and propagation delay.
Sketch a 2-, 4- or 6-layer construction and export its dimensions for fabrication review.
Build an editable planning budget from board size, quantity and explicit cost assumptions.
| Property | Value | Measurement basis |
|---|---|---|
| Process dielectric constant | 3.48 ± 0.05 | 10 GHz, 23°C; clamped stripline |
| Design dielectric constant | 3.66 | 8–40 GHz; differential phase length |
| Dissipation factor | 0.0037 | 10 GHz, 23°C; typical |
| Dissipation factor | 0.0031 | 2.5 GHz, 23°C; typical |
| Glass transition temperature | >280°C | TMA; not a continuous-use rating |
| Decomposition temperature | 390°C | TGA; not a reflow setting |
| Thermal conductivity | 0.69 W/(m·K) | 80°C; typical |
The 4 mil core has a separate process-Dk value of 3.33 ±0.05. Typical values are not procurement limits. Read conditions and exceptions.
The standard published process Dk is 3.48 ±0.05 at 10 GHz and 23°C
A 50-ohm trace width depends on dielectric height, design Dk, conductor thickness, solder mask and neighboring copper
Hybrid construction can reserve RF material for critical fields while using another laminate elsewhere
Surface finish selection balances RF loss, solderability, assembly, storage and reliability requirements
Power-amplifier boards combine RF matching with heat removal, bias distribution and stability requirements
RO4350B provides a defined RF material system, while FR-4 is a broad family with many electrical properties
Resolve common RO4350B decisions with the source and model in view.
RO4350B is a glass-reinforced hydrocarbon/ceramic thermoset laminate used for RF and microwave PCBs. Its electrical behavior depends on the exact construction and test conditions. Read the material overview.
3.48 ±0.05 is a process-test value; 3.66 is the published design starting value for standard constructions. They are measured differently. Choose a design model.
The workbench supports preliminary line calculations, stackup sketches and budget planning. It does not generate validated Gerbers or replace PCB CAD and EM simulation. Start a stackup brief.
Use the budget tool to explore assumptions, then send revision-matched fabrication files and requirements to a supplier. Prepare your quotation request.
Explore Rogers RO4350b fabrication information at RAYPCB. When you have a design brief, request a Rogers 4350B PCB quotation from PCBSync.
Supplier references are external resources. Confirm capabilities, material traceability, prices and delivery directly.