MATERIALS

The 4 mil RO4350B process-Dk exception

The cited Rogers data sheet gives 4 mil RO4350B a process Dk of 3.33 ±0.05. This is a specific footnote to the process measurement; it is not permission to replace every design model with 3.33.

ENGINEERING ANSWER

The cited Rogers data sheet gives 4 mil RO4350B a process Dk of 3.33 ±0.05. This is a specific footnote to the process measurement; it is not permission to replace every design model with 3.33.

What to decide before release

Thin substrates make dimensional tolerance, copper thickness and etching more significant relative to the dielectric height. Ask for a field-solver model and a coupon built with the same foil and plating as the circuit.

Checks to put in your design brief

  • Flag the 4 mil footnote in the material record
  • Confirm the design model with the supplier
  • Check manufacturable line widths

Important distinction

A generic 50-ohm width table for a thicker core can be badly misleading when scaled without accounting for copper.

Turn this into a design decision

Record your selected construction, the assumptions that affect this topic, and the evidence needed before release. Use the engineering workbench to prepare a preliminary calculation, then discuss the exact stackup and acceptance requirements with the fabricator.

Prepare a fabrication RFQ →

Sources & basis

Material facts follow the cited source. Design checks are preliminary guidance, not supplier process instructions.

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