Copper thickness and copper surface profile are separate design choices. Standard electrodeposited foil and a low-profile option can produce different conductor loss even at the same nominal copper weight. Plating also changes the finished trace thickness.
What to decide before release
State starting foil and required finished copper separately. Ask which foil surface faces the dielectric and which roughness model is supported. Use the real conductor thickness in the final field solver; the quick calculator on this site assumes zero thickness.
Checks to put in your design brief
- Record starting and finished copper
- Confirm the exact foil grade
- Include plating and etch compensation
Important distinction
The label “1 oz” is not a complete high-frequency conductor model and does not describe sidewall shape or roughness.
Sources & basis
Material facts follow the cited source. Design checks are preliminary guidance, not supplier process instructions.