MATERIALS

Copper weight and foil choice for RO4350B

Copper thickness and copper surface profile are separate design choices. Standard electrodeposited foil and a low-profile option can produce different conductor loss even at the same nominal copper weight. Plating also changes the finished trace thickness.

ENGINEERING ANSWER

Copper thickness and copper surface profile are separate design choices. Standard electrodeposited foil and a low-profile option can produce different conductor loss even at the same nominal copper weight. Plating also changes the finished trace thickness.

What to decide before release

State starting foil and required finished copper separately. Ask which foil surface faces the dielectric and which roughness model is supported. Use the real conductor thickness in the final field solver; the quick calculator on this site assumes zero thickness.

Checks to put in your design brief

  • Record starting and finished copper
  • Confirm the exact foil grade
  • Include plating and etch compensation

Important distinction

The label “1 oz” is not a complete high-frequency conductor model and does not describe sidewall shape or roughness.

Turn this into a design decision

Record your selected construction, the assumptions that affect this topic, and the evidence needed before release. Use the engineering workbench to prepare a preliminary calculation, then discuss the exact stackup and acceptance requirements with the fabricator.

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Sources & basis

Material facts follow the cited source. Design checks are preliminary guidance, not supplier process instructions.

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