Standard thicknesses in the cited sheet include 4, 6.6, 10, 20, 30 and 60 mil. Core thickness means dielectric thickness before adding the complete finished-board construction. Copper, bonding layers and solder mask change the final thickness.
What to decide before release
Choose thickness from impedance geometry, component launch dimensions, mechanical constraints and radiation behavior. For the same target impedance, a thicker substrate generally needs a wider trace. Very thin constructions may instead challenge minimum feature size or handling.
Checks to put in your design brief
- Request the available nominal core and tolerance
- Distinguish core from finished thickness
- Check connector pin-to-ground geometry
Important distinction
Do not assume a distributor stocks every listed thickness or copper combination. Confirm availability before releasing artwork.
Sources & basis
Material facts follow the cited source. Design checks are preliminary guidance, not supplier process instructions.