MANUFACTURING

Selecting a surface finish for RO4350B

Surface finish selection balances RF loss, solderability, assembly, storage and reliability requirements. There is no universally best finish for every RO4350B circuit or frequency.

ENGINEERING ANSWER

Surface finish selection balances RF loss, solderability, assembly, storage and reliability requirements. There is no universally best finish for every RO4350B circuit or frequency.

What to decide before release

Compare candidate finishes on the actual exposed RF geometry. Nickel-bearing finishes may influence loss, while other finishes introduce their own handling and reliability considerations. Ask the fabricator to state process thickness and storage guidance.

Checks to put in your design brief

  • List RF and assembly priorities
  • Model or measure relevant finish effects
  • Confirm shelf-life and handling

Important distinction

Do not recommend ENIG for every RF board merely because it provides flat pads.

Turn this into a design decision

Record your selected construction, the assumptions that affect this topic, and the evidence needed before release. Use the engineering workbench to prepare a preliminary calculation, then discuss the exact stackup and acceptance requirements with the fabricator.

Prepare a fabrication RFQ →

Sources & basis

Material facts follow the cited source. Design checks are preliminary guidance, not supplier process instructions.

Continue your research

manufacturing

ENIG on RO4350B RF boards

ENIG offers a common solderable finish, but its nickel layer can affect high-frequency conductor behavior