MANUFACTURING

ENIG on RO4350B RF boards

ENIG offers a common solderable finish, but its nickel layer can affect high-frequency conductor behavior. The importance depends on frequency, line geometry and which portions of the RF current path receive the finish.

ENGINEERING ANSWER

ENIG offers a common solderable finish, but its nickel layer can affect high-frequency conductor behavior. The importance depends on frequency, line geometry and which portions of the RF current path receive the finish.

What to decide before release

Evaluate electrical and assembly needs together. Discuss selective finish or RF mask openings only if the supplier supports them. Compare test structures with the same geometry and clearly documented finish process.

Checks to put in your design brief

  • Specify the finish process
  • Identify exposed RF conductors
  • Validate loss and solderability requirements

Important distinction

A gold appearance does not mean the current flows in a thick, pure-gold conductor.

Turn this into a design decision

Record your selected construction, the assumptions that affect this topic, and the evidence needed before release. Use the engineering workbench to prepare a preliminary calculation, then discuss the exact stackup and acceptance requirements with the fabricator.

Prepare a fabrication RFQ →

Sources & basis

Material facts follow the cited source. Design checks are preliminary guidance, not supplier process instructions.

Continue your research

manufacturing

OSP and RO4350B assembly planning

Organic solderability preservative can be considered where the assembly process and exposed-copper requirements support it