ENGINEERING ANSWER
A multilayer lamination cycle belongs to the complete material and bonding system. Core selection alone does not determine pressed dielectric thickness, resin flow or registration.
What to decide before release
Ask for a released stackup with bonding-layer names and expected pressed thicknesses. Review copper distribution, fill requirements and symmetry. Where RO4400 bondplies are used, consult the applicable bonding guidance rather than transferring an FR-4 recipe blindly.
Checks to put in your design brief
- Approve the bonding system
- Balance copper where practical
- Track pressed thickness assumptions
Important distinction
Nominal unpressed bondply thickness is not automatically the final dielectric spacing.
Sources & basis
Material facts follow the cited source. Design checks are preliminary guidance, not supplier process instructions.