MANUFACTURING

Etch tolerance and RO4350B impedance

Etching changes the realized width and sidewall shape of a conductor. The effect on impedance depends on its size relative to substrate height and copper thickness, making narrow traces particularly sensitive.

ENGINEERING ANSWER

Etching changes the realized width and sidewall shape of a conductor. The effect on impedance depends on its size relative to substrate height and copper thickness, making narrow traces particularly sensitive.

What to decide before release

Provide finished-line requirements and impedance targets, then allow the fabricator to propose artwork compensation. Evaluate plausible dimensional corners with a field solver and avoid using unnecessary decimal precision in the drawing.

Checks to put in your design brief

  • Agree finished width and tolerance
  • Check minimum gaps
  • Review impedance at dimensional corners

Important distinction

Do not assume the drawn CAD width equals the finished conductor width after plating and etching.

Turn this into a design decision

Record your selected construction, the assumptions that affect this topic, and the evidence needed before release. Use the engineering workbench to prepare a preliminary calculation, then discuss the exact stackup and acceptance requirements with the fabricator.

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Sources & basis

Material facts follow the cited source. Design checks are preliminary guidance, not supplier process instructions.

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OSP and RO4350B assembly planning

Organic solderability preservative can be considered where the assembly process and exposed-copper requirements support it

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Panelizing RO4350B PCBs

Panel yield depends on usable panel area, rails, board spacing, coupons, tooling and routing strategy

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Assembling RO4350B PCBs

Assembly planning must account for the full board and component system: finish, copper distribution, moisture exposure, thermal mass, package limits and mechanical support