ENGINEERING ANSWER
Assembly planning must account for the full board and component system: finish, copper distribution, moisture exposure, thermal mass, package limits and mechanical support. Laminate Tg alone does not define the reflow profile.
What to decide before release
Use a measured profile on a representative assembly. Confirm whether any exposed RF traces, connectors or sensitive components need special handling. Keep the fabrication and assembly revisions synchronized.
Checks to put in your design brief
- Approve a measured thermal profile
- Check component and connector limits
- Inspect RF interfaces after assembly
Important distinction
Do not translate a decomposition-temperature value into a soldering set point.
Sources & basis
Material facts follow the cited source. Design checks are preliminary guidance, not supplier process instructions.