DESIGN

Planning a 4-layer RO4350B hybrid stackup

A four-layer hybrid can place the RF path over a RO4350B dielectric while using other materials for less sensitive functions. The RF field must remain within the intended dielectric region for that concept to work.

ENGINEERING ANSWER

A four-layer hybrid can place the RF path over a RO4350B dielectric while using other materials for less sensitive functions. The RF field must remain within the intended dielectric region for that concept to work.

What to decide before release

Start with the signal and its adjacent reference plane. Then add bonding and digital/power layers with a fabricator-approved construction. Review symmetry and copper balance rather than assembling arbitrary thicknesses in a drawing.

Checks to put in your design brief

  • Identify the RF reference plane
  • Name the pressed bonding layers
  • Review bow and twist requirements

Important distinction

“Rogers plus FR-4” is an incomplete stackup. The exact FR-4 and bonding system must be agreed.

Turn this into a design decision

Record your selected construction, the assumptions that affect this topic, and the evidence needed before release. Use the engineering workbench to prepare a preliminary calculation, then discuss the exact stackup and acceptance requirements with the fabricator.

Prepare a fabrication RFQ →

Sources & basis

Material facts follow the cited source. Design checks are preliminary guidance, not supplier process instructions.

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