Stripline routes a signal between reference planes. It offers a different field environment from surface microstrip, but introduces bonding-layer, registration and via-transition decisions that must be included in the stackup model.
What to decide before release
Use a solver that supports the actual asymmetric or symmetric cross-section. Identify each dielectric above and below the trace; a multilayer built with RO4350B cores and a different bondply does not have one universal dielectric constant.
Checks to put in your design brief
- Name both surrounding dielectric systems
- Model signal transitions into the buried layer
- Confirm accessible test structures
Important distinction
The microstrip calculator on this site is not valid for stripline. Use a field solver with the full layer geometry.
Sources & basis
Material facts follow the cited source. Design checks are preliminary guidance, not supplier process instructions.