Professional Guide to RO4350B Laminates for RF, Microwave & 5G Applications
Rogers 4350B is a premium high-frequency circuit board laminate material engineered for demanding RF and microwave applications. This woven glass-reinforced hydrocarbon/ceramic composite delivers exceptional electrical performance comparable to PTFE-based materials while maintaining the processing simplicity and cost-effectiveness of standard epoxy/glass laminates. For comprehensive technical specifications and manufacturing capabilities, explore our detailed Rogers 4350B resource center. With a stable dielectric constant of 3.48 and ultra-low loss tangent of 0.0037, RO4350B enables reliable signal transmission from 500MHz to over 77GHz, making it the material of choice for 5G infrastructure, automotive radar systems, aerospace communications, and precision RF circuits requiring consistent performance across extreme temperature variations and high-frequency operations.
3.48 @ 10GHz
0.0037 @ 10GHz
0.6 W/mK
>280°C
±0.05
500MHz - 77GHz+
3.48 ± 0.05
Stable from 500MHz to 40GHz0.0037
At 10GHz, remains <0.004 to 77GHz1.7 × 10¹⁰ MΩ·cm
Excellent insulation properties4.2 × 10⁹ MΩ
High reliability0.6 W/m/K
Enhanced heat dissipation30 ppm/°C
Matches copper, reliable PTH10-14 ppm/°C
Excellent dimensional stability>280°C (536°F)
Superior thermal resistance>400°C
Excellent stability<0.1%
24 hrs immersionRogers 4350B laminates are available in multiple thickness options to suit various design requirements:
Standard Panel Sizes: 12"×18" (305×457mm), 24"×18" (610×457mm), 24"×36" (610×915mm)
Understanding the differences between Rogers 4350B and standard FR4 helps engineers select the optimal material for their specific application requirements. While FR4 excels in cost-effectiveness for general applications, Rogers 4350B delivers superior performance for high-frequency designs.
| Property | Rogers 4350B | Standard FR4 | Advantage |
|---|---|---|---|
| Dielectric Constant (Dk) | 3.48 ± 0.05 | 4.2 - 4.8 (varies) | Lower & more stable |
| Loss Tangent (Df) | 0.0037 @ 10GHz | 0.015 - 0.025 | 4-7× lower loss |
| Dk Stability over Frequency | Excellent (500MHz-77GHz) | Poor (varies significantly) | Predictable impedance |
| Dk Stability over Temperature | ±4‰ (-50°C to +150°C) | ±10% or more | Reliable in extreme temps |
| Glass Transition (Tg) | >280°C | 130-150°C | 2× higher thermal limit |
| Thermal Conductivity | 0.6 W/m/K | 0.3-0.4 W/m/K | Better heat dissipation |
| Moisture Absorption | <0.1% | 0.15-0.25% | More stable in humidity |
| CTE Z-axis | 30 ppm/°C | 50-70 ppm/°C | Better PTH reliability |
| Processing | Standard FR4 methods | Standard methods | Both easy to process |
| Suitable Frequency Range | 500MHz - 77GHz+ | DC - 2GHz | High-frequency capable |
| Cost (Relative) | 2-5× FR4 | Baseline (1×) | FR4 more economical |
| Best Applications | RF, 5G, Radar, mmWave | General digital, power | Material-specific |
Designing with Rogers 4350B requires attention to high-frequency circuit principles and material-specific characteristics. Following these guidelines ensures optimal performance and manufacturability.
Use impedance calculators with Dk=3.48 to determine precise trace widths and spacing. Account for copper roughness effects at high frequencies. For 50Ω microstrip on 0.508mm (20mil) substrate with 1oz copper, typical trace width is approximately 1.1mm. Utilize controlled impedance design tools like Saturn PCB Toolkit or LineCalc for accurate modeling.
Select appropriate core thickness based on target impedance and frequency. Consider mixed dielectric stackups: use Rogers 4350B for RF signal layers and FR4 for digital/power layers to optimize cost. Ensure symmetrical construction to prevent warpage. For multilayer designs, maintain balanced copper distribution and account for prepreg thickness variations.
Leverage 0.6 W/mK thermal conductivity by incorporating thermal vias beneath power components. Design adequate copper planes for heat spreading. Space thermal vias 0.5-1mm apart in arrays under high-power devices. Calculate junction temperatures considering both substrate thermal resistance and convection to ambient.
Avoid 90° corners; use chamfered or curved traces (radius ≥3× trace width). Maintain consistent trace widths throughout signal paths. Taper impedance transitions gradually over λ/4 or longer distances. Minimize stub lengths on vias—use back-drilling for critical high-frequency signals above 10GHz.
Design vias with appropriate aspect ratios (drill diameter:board thickness ratio <10:1 for reliability). Utilize low Z-axis CTE (30 ppm/°C) for reliable plated-through holes. For RF vias, consider via fences (ground via spacing <λ/8) to prevent coupling. Standard via barrel thickness: 1 mil (25μm) minimum copper plating.
Implement solid ground planes beneath RF traces. Use ground via stitching around signal paths (spacing ≤λ/8 at highest frequency). Create coplanar waveguide (CPW) structures where appropriate for controlled impedance. Isolate sensitive RF sections from noisy digital circuitry with ground barriers.
Clearly specify Rogers 4350B material and thickness on fabrication drawings. Indicate process Dk for 4-mil material (Dk=3.33) if used. Specify impedance requirements with tolerance (typically ±5-10%). Rogers 4350B processes with standard FR4 equipment—no special sodium etching required. Confirm manufacturer capabilities for mixed dielectric stackups if applicable.
Perform electromagnetic (EM) simulation using tools like HFSS, CST, or ADS Momentum before fabrication. Validate S-parameters, insertion loss, and return loss across operating frequency range. Account for surface roughness in simulations (RMS roughness ~3-5μm). Plan for post-fabrication measurements: Time-Domain Reflectometry (TDR) for impedance verification and Vector Network Analyzer (VNA) for S-parameter characterization.
Rogers 4350B pricing varies based on multiple factors including material thickness, panel size, order volume, and complexity. Understanding these cost drivers helps in budget planning and design optimization.
$200-800 / m²
$100-150
2-5× Higher
20-40% Savings
Thinner materials (0.101-0.254mm) generally cost less per panel but may require specialized handling. Standard thicknesses (0.508mm, 0.762mm) are most readily available. Thicker substrates (>1.0mm) command premium pricing due to lower demand and handling requirements.
Standard panel sizes (12"×18", 24"×18") offer best pricing. Custom panel sizes incur additional costs. Maximize panel utilization through efficient nesting to reduce per-unit cost. Typical utilization efficiency: 70-85% for well-optimized designs.
2-layer Rogers 4350B: Baseline cost. 4-layer designs: 50-80% premium over 2-layer. 6+ layers: Exponential cost increase. Mixed dielectric stackups (Rogers 4350B + FR4) can reduce costs by 30-50% vs all-Rogers construction while maintaining RF performance in critical layers.
Standard 1oz (35μm) copper: Baseline. 2oz copper: +15-25% cost. Low-profile (LP) copper: +5-10% premium but reduces conductor losses. Fine-line capability (<0.1mm traces): +20-35% for specialized processing.
Prototype (5-10 pcs): $100-150 per board for 100×100mm 2-layer design
Low Volume (25-50 pcs): 20-30% discount per board
Medium Volume (100-500 pcs): 35-45% discount per board
Production (>1000 pcs): 50-60% discount, negotiate annual pricing
Standard lead time (15-20 days): Base price. Quick-turn (5-10 days): +30-50% expedite fee. Rush service (<5 days): +80-120% expedite fee. Long lead times (30+ days) may offer small discounts for stable production schedules.
Use Rogers 4350B only for RF signal layers; employ FR4 for digital and power layers to reduce material costs by 30-50%.
Specify commonly available thicknesses (0.508mm, 0.762mm) to avoid custom ordering premiums and reduce lead times.
Design for efficient panel utilization with proper spacing and orientation to maximize boards per panel, reducing per-unit costs.
Consolidate orders to achieve volume pricing tiers. Consider annual contracts for recurring production needs to negotiate better rates.
While Rogers 4350B costs 2-5× more than FR4, it delivers significantly lower insertion loss, better impedance control, and superior thermal stability. For high-frequency applications above 2GHz, the performance gains justify the material premium. The ability to process Rogers 4350B with standard FR4 equipment (unlike PTFE materials) helps contain manufacturing costs, making it the most cost-effective high-performance laminate for many RF applications.
Rogers 4350B's combination of low loss, stable dielectric properties, and excellent thermal performance makes it ideal for diverse high-frequency applications across telecommunications, automotive, aerospace, and industrial sectors.
Low loss tangent minimizes signal attenuation in sub-6GHz and mmWave 5G infrastructure. Stable Dk ensures consistent antenna radiation patterns and impedance matching across wide bandwidths.
High thermal conductivity (0.6 W/mK) enables efficient heat dissipation from power transistors. Low loss reduces self-heating. Suitable for cellular base stations, broadcast transmitters, and military communications.
Stable dielectric constant over temperature (-40°C to +125°C) ensures reliable performance in harsh automotive environments. Used in adaptive cruise control, collision avoidance, blind-spot detection, and autonomous driving sensors.
Ultra-low loss tangent maintains signal quality over long transmission distances in backhaul networks. Frequency stability enables tight channel spacing and high-order modulation schemes.
Consistent electrical performance across Ku-band, Ka-band, and beyond. Low outgassing and radiation resistance suitable for space applications. Used in satellite transceivers, ground station equipment, and SATCOM terminals.
Cost-effective solution for UHF RFID systems operating at 860-960MHz. Better performance than FR4 with reasonable pricing compared to pure PTFE materials. Applications in inventory management, access control, and asset tracking.
Tight Dk tolerance (±0.05) ensures phase accuracy across antenna elements. Low loss maximizes aperture efficiency. Critical for radar, electronic warfare, and beamforming systems requiring precise phase control.
High reliability and stable performance in demanding military applications including radar warning receivers, electronic countermeasures, tactical communications, missile guidance, and avionics systems. Qualified to MIL-PRF standards.
Low loss benefits high-frequency medical diagnostic systems including MRI RF coils and ultrasound transceivers. Biocompatible laminate construction suitable for proximity to patients. High thermal stability during sterilization cycles.
Cellular base station power amplifiers, low-noise amplifiers (LNAs), duplexers, and antenna matching networks. Supports 3G, 4G LTE, and 5G technologies. DAS (Distributed Antenna Systems) and small cell deployments.
RF test fixtures, calibration standards, vector network analyzer test boards, and spectrum analyzer accessories. Precision and repeatability essential for accurate measurements. Stable reference impedances for calibration.
Wireless sensor nodes, smart meters, industrial IoT gateways, and connected vehicle modules. Enables reliable multi-band operation across Wi-Fi, Bluetooth, LoRa, NB-IoT, and cellular connectivity in compact form factors.
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