Rogers 4350B Material Properties
| Dielectric Constant (Dk) | 3.48 ± 0.05 |
| Loss Tangent (Df) | 0.0037 @10GHz |
| Volume Resistivity | 1.2×10¹⁰ MΩ·cm |
| Surface Resistivity | 4.2×10⁹ MΩ |
| Arc Resistance | 125 sec |
| Glass Transition (Tg) | >280°C |
| Thermal Conductivity | 0.69 W/m/K |
| CTE (X-axis) | 10 ppm/°C |
| CTE (Y-axis) | 12 ppm/°C |
| CTE (Z-axis) | 32 ppm/°C |
| Tensile Modulus | 12,066 MPa |
| Tensile Strength | 186 MPa |
| Flexural Strength | 241 MPa |
| Peel Strength (1oz) | 1.05 N/mm |
| Density | 1.86 g/cm³ |
| 0.004" (4 mil) | 0.102 mm |
| 0.006" (6.6 mil) | 0.168 mm |
| 0.010" (10 mil) | 0.254 mm |
| 0.020" (20 mil) | 0.508 mm |
| 0.030" (30 mil) | 0.762 mm |
| 0.060" (60 mil) | 1.524 mm |
Microstrip Impedance Calculator
Microstrip Cross-Section View
| 50Ω (10mil sub) | W = 0.55mm |
| 50Ω (20mil sub) | W = 1.12mm |
| 75Ω (10mil sub) | W = 0.25mm |
| 100Ω Diff (10mil) | W=0.2, S=0.2mm |
| 90Ω Diff (10mil) | W=0.25, S=0.15mm |
Layer Stack-up Designer
| RO4450F | Dk: 3.52 |
| RO4450B | Dk: 3.54 |
| Thickness | 3-4 mil |
| Max Layers | 20+ |
| FR-4 Hybrid | Supported |
Design for Manufacturing Tips
Drilling Considerations
Rogers 4350B requires carbide drills with high helix angles. Minimum via size: 8 mil (0.2mm). Use pecking cycles for aspect ratios >6:1. Reduce drill speed by 20% compared to FR-4 to prevent delamination.
Copper Adhesion
Ensure proper surface preparation before copper plating. Use micro-etching process for better adhesion. Recommended peel strength: >1.0 N/mm. Avoid aggressive cleaning chemicals that may damage the laminate.
Impedance Control
Account for ±0.05 Dk variation in impedance calculations. Add test coupons for impedance verification. Use ground pour stitching every λ/20. Maintain 3H rule for trace-to-edge clearance.
Via Design for RF
Use via fencing around RF traces (λ/10 spacing). Back-drill stubs for frequencies >5GHz. Implement via-in-pad with filled and capped vias. Ground via arrays around connectors and transitions.
Thermal Management
Include thermal relief patterns for high-power components. Use thermal vias under QFN/BGA packages. Consider copper coin insertion for heat spreading. Operating temp range: -55°C to +125°C.
Hybrid Stackup Design
Rogers 4350B can be combined with FR-4 for cost optimization. Use Rogers for RF layers, FR-4 for digital. Match CTE carefully at material transitions. Use RO4450F prepreg for best results.
Surface Finish Selection
ENIG recommended for RF applications (flat surface, good solderability). OSP acceptable for lower frequency (<3GHz). Immersion silver provides excellent RF performance. Avoid HASL for fine-pitch components.
Panel Utilization
Standard panel size: 18"×24" or 18"×12". Optimize board placement for material yield. Include tooling holes and fiducials. Minimum board-to-edge clearance: 5mm. Add breakaway tabs with mouse bites.
PCB Cost Estimator
* This is an estimate only. Final pricing may vary based on specific requirements.
Contact RAYPCB for an accurate quote.
Material Comparison
| Property | Rogers 4350B | Rogers 4003C | Taconic TLY | FR-4 |
|---|---|---|---|---|
| Dielectric Constant (Dk) | 3.48 | 3.55 | 2.2 | 4.2-4.5 |
| Loss Tangent (Df) @10GHz | 0.0037 | 0.0027 | 0.0009 | 0.020 |
| Max Frequency | 40 GHz | 40 GHz | 77 GHz | 3 GHz |
| FR-4 Process Compatible | Yes | Yes | Limited | Yes |
| Thermal Conductivity | 0.69 W/m/K | 0.64 W/m/K | 0.22 W/m/K | 0.29 W/m/K |
| CTE (Z-axis) | 32 ppm/°C | 46 ppm/°C | 280 ppm/°C | 70 ppm/°C |
| Relative Cost | Medium | Medium | High | Low |
| Best Application | Radar, 5G, Automotive | Base Stations, GPS | mmWave, Aerospace | Digital, Low-Freq |
Why Choose Rogers 4350B?
Rogers 4350B offers an excellent balance of RF performance, manufacturability, and cost. Its FR-4 compatible processing makes it ideal for high-volume production while maintaining low loss characteristics up to 40GHz. Perfect for 5G infrastructure, automotive radar (24/77GHz), satellite communications, and high-speed digital applications.