What is Rogers 4000 material?

Key Features of Rogers 4000 Materials

The Rogers 4000 series materials exhibit several key features that make them well-suited for high-frequency applications:

Low dielectric constant (Dk) and dissipation factor (Df)
Excellent thermal stability
Low moisture absorption
High dimensional stability
Compatibility with standard PCB fabrication processes

Low Dielectric Constant and Dissipation Factor

Rogers 4000 materials have a low dielectric constant (Dk), which ranges from 2.55 to 3.48, depending on the specific product. This low Dk helps to minimize signal propagation delay and reduce signal losses. Additionally, these materials have a low dissipation factor (Df), typically between 0.0012 and 0.0037, which further contributes to low signal losses and high-quality signal transmission.

Excellent Thermal Stability

The Rogers 4000 series materials maintain their electrical properties over a wide temperature range, typically from -55°C to +150°C. This thermal stability ensures reliable performance in demanding environmental conditions, such as those found in aerospace and automotive applications.

Low Moisture Absorption

These materials have low moisture absorption, typically less than 0.1% by weight. This low moisture absorption helps to maintain the material’s electrical properties and dimensional stability, even in humid environments.

High Dimensional Stability

Rogers 4000 materials exhibit high dimensional stability, with a low coefficient of thermal expansion (CTE) in the z-axis direction. This stability minimizes warping and twisting of the PCB, ensuring consistent performance and reliability.

Compatibility with Standard PCB Fabrication Processes

Rogers 4000 series materials are compatible with standard PCB fabrication processes, including drilling, milling, and plating. This compatibility allows for easy integration into existing manufacturing workflows and reduces the need for specialized equipment or processes.

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Rogers 4000 Series Product Overview

The Rogers 4000 series consists of several products, each with unique properties and applications. The following table provides an overview of the main products in the series:

Product	Dielectric Constant (Dk)	Dissipation Factor (Df)	Thickness (mm)	Key Features
RO4003C	3.38 ± 0.05	0.0027 @ 10 GHz	0.2 – 1.524	Lowest loss, high thermal conductivity
RO4350B	3.48 ± 0.05	0.0037 @ 10 GHz	0.2 – 1.524	High Dk, low loss, high thermal conductivity
RO4360G2	6.15 ± 0.15	0.0038 @ 10 GHz	0.2 – 1.524	Very high Dk, low loss
RO4450F	3.52 ± 0.05	0.0040 @ 10 GHz	0.2 – 0.508	Low loss, low z-axis CTE
RO4835	3.48 ± 0.05	0.0037 @ 10 GHz	0.2 – 1.524	Low loss, high thermal conductivity

RO4003C

RO4003C is the lowest loss material in the Rogers 4000 series, with a dielectric constant of 3.38 and a dissipation factor of 0.0027 at 10 GHz. This material also has high thermal conductivity, making it suitable for high-power applications. RO4003C is often used in applications such as wireless communications, satellite systems, and radar.

RO4350B

RO4350B has a slightly higher dielectric constant of 3.48 and a dissipation factor of 0.0037 at 10 GHz. This material also offers high thermal conductivity and is well-suited for applications that require a balance between electrical performance and thermal management. RO4350B is commonly used in wireless communications, automotive radar, and aerospace systems.

RO4360G2

RO4360G2 has the highest dielectric constant in the series at 6.15, along with a low dissipation factor of 0.0038 at 10 GHz. This high dielectric constant makes RO4360G2 ideal for applications that require miniaturization or high capacitance, such as RF filters and couplers. This material is often used in wireless communications and defense systems.

RO4450F

RO4450F has a dielectric constant of 3.52 and a dissipation factor of 0.0040 at 10 GHz. This material has a low z-axis coefficient of thermal expansion (CTE), which makes it suitable for applications that require high dimensional stability. RO4450F is commonly used in automotive radar, aerospace, and defense systems.

RO4835

RO4835 has a dielectric constant of 3.48 and a dissipation factor of 0.0037 at 10 GHz, similar to RO4350B. This material also offers high thermal conductivity and is often used in applications that require a balance between electrical performance and thermal management. RO4835 is used in wireless communications, satellite systems, and radar applications.

Applications of Rogers 4000 Materials

Rogers 4000 series materials are used in a wide range of high-frequency applications, including:

Wireless communications
5G networks
Cellular base stations
Satellite communications
IoT devices
Automotive
Advanced driver assistance systems (ADAS)
Automotive radar
Vehicle-to-vehicle (V2V) communication
Vehicle-to-infrastructure (V2I) communication
Aerospace and defense
Radar systems
Avionics
Missile guidance systems
Electronic warfare
Industrial
High-frequency test equipment
Microwave heating
Non-destructive testing (NDT)
Medical imaging

Designing with Rogers 4000 Materials

When designing PCBs with Rogers 4000 series materials, several factors should be considered to ensure optimal performance and reliability:

Material selection: Choose the appropriate Rogers 4000 material based on the specific application requirements, such as dielectric constant, dissipation factor, and thermal conductivity.
Copper cladding: Rogers 4000 materials are available with various copper cladding options, including standard copper, reverse-treated copper (RTC), and low-profile copper (LPC). Select the appropriate cladding based on the desired signal integrity and trace geometry.
Lamination: Proper lamination is crucial for achieving good adhesion between the Rogers 4000 material and the copper cladding. Follow the manufacturer’s recommended lamination process, including pressure, temperature, and time.
Via formation: When drilling vias in Rogers 4000 materials, use appropriate drill bits and parameters to minimize damage to the material and ensure clean, reliable via holes.
Impedance control: To maintain consistent impedance throughout the PCB, carefully design the trace geometry and spacing, considering the dielectric constant and thickness of the Rogers 4000 material.
Thermal management: Consider the thermal conductivity of the Rogers 4000 material and incorporate appropriate thermal management techniques, such as heat sinks or thermal vias, to dissipate heat effectively.

Frequently Asked Questions (FAQ)

Q: What is the main difference between Rogers 4000 series materials and standard FR-4 materials?
A: Rogers 4000 series materials have lower dielectric constants, lower dissipation factors, and higher thermal conductivity compared to standard FR-4 materials. These properties make Rogers 4000 materials better suited for high-frequency applications, where signal integrity and low loss are critical.
Q: Can Rogers 4000 materials be used in multilayer PCBs?
A: Yes, Rogers 4000 materials can be used in multilayer PCBs. However, special consideration must be given to the lamination process, as well as the selection of appropriate bonding materials and prepregs to ensure good adhesion and reliability between layers.
Q: Are Rogers 4000 materials compatible with lead-free soldering processes?
A: Yes, Rogers 4000 materials are compatible with lead-free soldering processes. However, it is essential to follow the manufacturer’s recommended soldering profile and guidelines to minimize thermal stress on the material and ensure reliable solder joints.
Q: How do I select the appropriate thickness for my Rogers 4000 material?
A: The thickness of the Rogers 4000 material should be selected based on the desired electrical performance, such as impedance and signal propagation delay, as well as the mechanical requirements of the PCB. Thinner materials may be preferred for high-frequency applications to minimize signal losses, while thicker materials may be necessary for improved mechanical stability.
Q: Can Rogers 4000 materials be used in flexible PCBs?
A: While Rogers 4000 materials are primarily designed for rigid PCBs, some products, such as RO4450F, can be used in flexible PCBs due to their low z-axis CTE. However, for most flexible PCB applications, other materials specifically designed for flexibility, such as Rogers ULTRALAM or DuPont Pyralux, may be more suitable.

In conclusion, Rogers 4000 series materials are high-performance dielectric materials designed for demanding high-frequency applications. With their low dielectric constants, low dissipation factors, and excellent thermal and dimensional stability, these materials enable the design of high-quality, reliable PCBs for wireless communications, automotive, aerospace, defense, and industrial applications. By carefully considering the material properties, design requirements, and manufacturing processes, engineers can leverage the benefits of Rogers 4000 materials to create cutting-edge electronic systems that push the boundaries of performance and innovation.